Elevate Your Assembly Process with MapSuite
MapSuite transforms the assembly process, offering comprehensive support from start to finish. Seamlessly delivering wafer substrate maps to die attachers, generating transfer maps for smooth transitions between substrates, and creating coat and cleave plans for photonics production are just a few of MapSuite’s capabilities. With MapSuite, you can enable multi-die assembly for PCBs or flexible substrate assembly, ensuring that only qualified products make their way into the final product.
Experience the Difference with MapSuite
Unlock the full potential of your assembly process with MapSuite. From delivering substrate maps to die attachers to visualizing the entire assembly journey, MapSuite offers unmatched support and functionality. Elevate your production standards and ensure the highest quality products with MapSuite.
Discover MapSuite today and revolutionize your assembly process. Contact us to learn more about MapSuite’s capabilities and start maximizing your manufacturing potential.
Key Features of MapSuite for Assembly
Wafer Substrate Map Delivery: MapSuite facilitates the delivery of wafer substrate maps to die attachers, streamlining the assembly process and ensuring accurate placement of dies.
Transfer Map Generation: MapSuite generates transfer maps, enabling seamless transitions from one substrate to another, while maintaining traceability and quality control.
Coat and Cleave Plans for Photonics: MapSuite empowers users to create coat and cleave plans for photonics production, optimizing efficiency and precision in the assembly process.
Multi-Die Assembly for PCBs and Flexible Substrates: With MapSuite, you can facilitate multi-die assembly for PCBs and flexible substrates, enhancing productivity and flexibility in production.
Visualization from Start to Finish: MapSuite provides visualization tools that allow you to track the assembly process from the initial substrate to the final assembled product, ensuring transparency and quality assurance at every stage.