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Welcome to MapSuite

…which is all about substrate maps…

  • Home
  • Solutions
    • Visual Layout
    • Substrate Types
    • Substrate Editing
    • Merge Substrate Maps
    • Stack Substrate Maps
    • Visual Inspection
    • Substrate Chipping and Scratches
    • Split Substrates
    • Transfer Map
    • Multi Project Wafer
    • Chiplets
    • Assembly
    • Particle Inspection
    • Parametric Test Data
    • Measurement Data
    • Substrate File Formats
    • Real Time Maps
    • Multi Site
  • Industries
  • Contact

Solutions

Visual Substrate Layout

Show visually the substrates in a web-browser, so the user has an overview of how production results look like.

Substrate Types

Many different substrates are supported, being it semiconductor or photonic wafers. Also lead- frames and trays are supported, or even single products. As well as waffle and gel packs can be used.

Substrate Editing

Substrates can be manually edit, when for example additional fail dies are found in a process, or when certain parts of a substrate should not be used for further processing.

Merge Substrate Maps

Merge production results of the substrate from different processes, having always updated substrates maps available.

Stack Substrate Maps

Stack bin results of a substrate map, to find common failures on certain positions of a wafer. For example, to judge which edge dies should have standard the status failed.

Visual Inspection

Store visual inspection results and have them available for an overlay with other production results, or merge the result with other substrate data.

Wafer Chipping and Scratches

Substrates like wafers are sensitive for chipping and scratches. This gives the need for the option to indicate where wafers are chipped or scratches.

Split Substrates

Sometimes wafers can break, but the products on the non-broken part will still work. Or a substrate needs to be split for different processes, like bars in the photonics world.

Transfer Maps

For high value, medical and automotive devices it is almost a must to have full traceability from the die on the wafer to the individual dies in an end product, a transfer map can help in this process.

Multi Project Wafer

With the increasing price and complexity of products, sample products are many times created using Multi Project Wafers. Those substrates are also supported.

Chiplets

Chiplets as well as a system in a package can be handled with MapSuite. Having different dies in one package next to each other, or stacked, it becomes all possible.

Assembly Process

For this process substrate maps can be used for assembly. Like an electronic map for the die attacher, or a coat and cleave plan for the photonics industry.

Particle Inspection

Over the years many file formats to contain the substrate information have been introduced. Basic of MapSuite is the E142 map, while supporting 50+ other formats. File conversion is therefore standard available.

Parametric Test Data

At test and assembly, it is sometimes desired to see a real time map of production, but the equipment is not capable of that, MapSuite can help here out as well.

Measurement Data

Many times production runs at different locations, with the Multi Site Option data can be exchanged between different locations within the company. But substrate maps can also be exchanged with subcontractor for example, and that two ways, receive and send.

 

File Formats

Over the years many file formats to contain the substrate information have been introduced. Basic of MapSuite is the E142 map, while supporting 50+ other formats. File conversion is therefore standard available.

Real Time Maps

At test and assembly, it is sometimes desired to see a real time map of production, but the equipment is not capable of that, MapSuite can help here out as well.

Multi Site

Many times production runs at different locations, with the Multi Site Option data can be exchanged between different locations within the company. But substrate maps can also be exchanged with subcontractor for example, and that two ways, receive and send.

 

 

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